Description:
Feature:
1. Extremely short cycle time with rotary table design. Product
loading and unloading can be done during the heat sealing process
2. High quality heat seal application up to 0.25mm pitch
3. Pneumatic bonding head provide up to 3,900N force
4. Digital programmable pressure control with LCD display
5. Closed loop PID temperature control with visible LED display
6. Bonding cycle is triggered by a real time pressure sensor
7. Floating Thermode ensure consistent pressure and heat transfer
along the flexfoil to LCD and/or PCB
8. Precision product fixtures (2X), easy exchange, provided with
micrometer alignment and vacuum to fix components
9. Optional CCD alignment module with frame, camera, lens, monitor
and illumination for fine pitch application
10. Full microprocessor logic
Specifications:
Model: YSPC-1A
Size: 620mm X 690mm X 570mm
Max. Working Area: 200mm X 260mm
Air Pressing: 0.45-0.7Mpa
Weight: 95Kg