Features:
1.750 plate splitting machine adopts six groups of cutting tools to cut step by step to reduce the shear stress to the minimum, and is equipped with deformation control device, the edge of the segmented substrate is smooth and smooth, the surface is very smooth, no twisting or warping, yes
About 0.6mm ultra-thin aluminum substrate slitting can still perfectly control its deformation in two wires, meet the glass
The strict requirement of deformation degree in pipe process
2. Because of multiple cutting, the cutting process is very smooth, greatly improving the positioning ability of V-CUT slot, even if the V-CUT slot is very shallow circuit board, there will be no V-CUT slot from the guide knife jump out of the situation, to avoid defective products.
3. All cutting blades are calibrated with an excited dual-frequency laser interferometer to ensure that the rear blade can be cut in the slot of the front blade
Continue cutting exactly. Tip beat no more than 0.02mm, to ensure perfect cutting quality.
4. Stainless steel platform with laser calibration positioning function (1.2m or 2.4m optional)
Application field
The YSL-750 is used in:
750 plate machine adopts six groups of cutting tools to cut step by step, the shear stress is reduced to the minimum, and the deformation control device is configured, the edge of the segmented substrate is smooth, the surface is very flat, no twisting or warping, the ultra-thin aluminum substrate cutting about 0.6mm can still perfectly control its deformation in two wires, to meet the glass tube process on the deformation of the harsh requirements.
Because of multiple cuts, the cutting process is very smooth, greatly improve the positioning ability of V-CUT slot, even if the V-CUT slot is very shallow circuit board, there will be no V-CUT slot from the guide knife jump out of the situation, avoid bad
a. Mainly used in electronic, electrical, lighting, medical, automobile new energy, automobile and other electronic technology industries;
Defective PCB board
Machine sub-board after PCB board
Equipment parameter
Machine specification
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490mm*400mm*350mm
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Plat size
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1200*450*350mm/2400*450*35mm
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Maximum splitter length
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Unlimited
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Split-plate velocity
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80, 120, 200, 400mm/s
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Power
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60W
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Tool material
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SKD61 High speed steel
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Plate thickness
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0.2-5mm
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Machine weight
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1.2M—65KG;2.4M—75KG
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Power supply
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230V/50Hz(110V/60Hz)
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