|
Model
|
YSL-A-BIB
|
IMAGE RECOGNITION
|
Item
|
|
|
CCD FOV
|
10x8 mm
|
Screen Frames
|
Min Size
|
470X370mm
|
Fiducial Types
|
□square○Round △Triangle,+cross Pad Hole
|
Max Size
|
737X550mm737X650mm(200-310)
|
Automatic Camera System
|
CCD digital camera
|
Thickness
|
25-40mm
|
Geometrypattern match
|
PCB Min Size
|
50X50mm
|
Lookup down optics structure
|
PCB Max Size
|
400X310mm
|
Working environment temperature
|
-21-℃-+50℃
|
PCB Thickness
|
0.4-6mm
|
Humidity of working environment
|
30%-60%
|
PCB Warpage
|
<1%
|
Power input
|
AC:220±10%50/60HZ 1&3KW
|
Transport Height
|
900±40mm
|
Control Method
|
PC Control
|
Transport Direction
|
Left-Right:Right-Left:Left-Left;Right-Right
|
Machine Dimensions
|
1220(L)X1355W)X1500(H)mm
1220(L)X2800W)X1500(H)mm
|
Transport Speed
|
Max1500mm/S Programmable
|
Machine Weight
|
Approx:1000Kg()2000KG()
|
Board Location PCB
|
Support System
|
Magnetic Pin/Up-down table adjusted/support block by hand
|
PRINTING PARAMETERS
|
Clamping System
|
side clamping.vacuum nozzle
|
PCB Max Size
|
400X310mm
|
Print head
|
Two independent motorised printheads
|
Squeegee Type
|
Stainless steel(Standard),plastic
|
Cleaning System
|
Dry,Wet,Vacuum(Programmable)
|
Substrate Separation
|
0.1~20mm/sec
|
Table Adjustment ranges
|
X:±10mm;Y:± 10mm;;±2º
|
Separation option
|
Separation after squeegee up;Squeegee up after
Separation ;
separation by keeping squeegee on the stencil
(Area Separation Line Separation)
|
Solder Paste Inspection
|
2DInspection
|
Squeegee Speed
|
6-200mm/sec
|
|
Squeegee Pressure
|
0~15Kg
|
Squeegee Angle
|
60º/55º/45º
|
Repeat Position Accuracy
|
±0.008mm(CPK>2.0)
|
Printing Accuracy
|
±0.02mm(CPK=>2.0
|
Cycle Time
|
<7s(Exclude Printing Cleaning)
|
Product Changeover
|
<5Min
|
Air Required
|
4.5-6 Kg/cm2
|